Products specifications
Attribute nameAttribute value
Country of OriginChina, Taiwan
Width0.15"
Depth2.74"
Height1.18"
Weight0.627 oz
JEDEC standardYes
Lead platingGold
Master (outer) case weight2.82 lbs
Master (outer) case length12.3"
Master (outer) case width8"
Master (outer) case height4"
Row cycle time48 ns
Refresh row cycle time295 ns
Row active time32 ns
SPD profileYes
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version3.0
Programming power voltage (VPP)1.8 V
SPD voltage1.1 V
SPD speed4800 MHz
Memory data transfer rate6400 MT/s
On-Die ECCYes
SPD latency39
Technical details
Product colorBlack
Packaging data
Package width3.75"
Package depth0.551"
Package height6.75"
Package weight1.51 oz
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Features
Internal memory32 GB
Internal memory typeDDR5
Memory clock speed3200 MHz
Component forLaptop
Memory form factor262-pin SO-DIMM
ECCNo
Buffered memory typeUnregistered (unbuffered)
CAS latency38
Memory voltage1.35 V
Cooling typeHeatsink
Memory layout (modules x size)2 x 16 GB
Memory ranking1
Memory channelsDual-channel
Module configuration2048M x 64
Logistics data
Quantity per master (outer) case25 pc(s)