Products specifications
Attribute nameAttribute value
Country of OriginChina, Taiwan
Width0.28"
Depth5.25"
Height1.62"
Weight1.37 oz
JEDEC standardYes
BacklightYes
Backlight colorRed/Green/Blue
Lead platingGold
Master (outer) case weight3.7 lbs
Master (outer) case length12.8"
Master (outer) case width7.6"
Master (outer) case height3.5"
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
SPD profileYes
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version2.0
Programming power voltage (VPP)2.5 V
Memory data transfer rate3200 MT/s
Packaging data
Package width2.5"
Package depth0.551"
Package height6.75"
Package weight2.04 oz
Operational conditions
Operating temperature (T-T)0 - 70 °C
Storage temperature (T-T)-40 - 85 °C
Features
Internal memory32 GB
Internal memory typeDDR4
Memory clock speed1600 MHz
Component forPC/server
Memory form factor288-pin DIMM
ECCNo
Buffered memory typeUnregistered (unbuffered)
CAS latency16
Memory voltage1.35 V
Cooling typeHeatsink
Memory layout (modules x size)1 x 32 GB
Memory ranking2
Module configuration4096M x 64
Logistics data
Quantity per master (outer) case25 pc(s)