FSB Parity | Y |
Number of Processing Die Transistors | 1900 M |
Processing Die size | 503 mm² |
Images Type Map | <div><img src="https://ark.intel.com/inc/images/diagrams/diagram-5.gif" title="Block Diagram" /><img src="https://ark.intel.com/inc/images/diagrams/diagram-6.gif" title="Block Diagram" /><img src="https://ark.intel.com/inc/images/diagrams/diagram-8.gif" title="Block Diagram" /></div> |
Bus bandwidth | 1066 |
Bus type units | MHz |
Product family | Intel Xeon Processor 7000 Sequence |
VID Voltage Range | 0.9 - 1.45 V |
Export Control Classification Number (ECCN) | 3A991.A.1 |
Launch date | Q3'08 |
Bus speed | 1066 MHz |
CPU multiplier (bus/core ratio) | 10 |
Tcase | 64 °C |
Processor front side bus | 1066 MHz |
Processor base frequency | 2.66 GHz |
Processor brand name | Intel Xeon |
L2 cache speed | 2.66 GHz |
Package height | 4.61" |
Maximum operating temperature | 64 °C |
Processor ARK ID | 36947 |
Processor family | Intel® Xeon® 7000 Sequence |
Processor model | X7460 |
Processor cache | 16384 KB |
Bus type | FSB |
Processor code | SLG9P |
Processor package size | 53.3mm x 53.3mm mm |
Processor series | Intel Xeon 7400 Series |
Processor socket | Socket 604 (mPGA604) |
Stepping | A1 |
Processor lithography | 45 nm |
Idle States | N |